AMTECH NC-559-ASM TF
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AMTECH NC-559-ASM TF

Was $85.01 SAVE 41%
$50.00
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DOWNLOADS Technical Data Sheet  Safety Data Sheet Product Info AMTECH NC-559-ASM-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH NC-559-ASM-TF may be used for BGA sphere attachment and reballing. AMTECH NC-559-ASM-TF is also designed to work on all flip chip bumping and chip scale packaging sites. Product Highlights: ROL0 flux classification  Wide process window Excellent wetting compatibility on most board finishes Clear residue High temperature compatible Available Alloys Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 60Sn/40Pb 183-191 361-376 43Sn/43Pb/14Bi 144-163 291-325 42Sn/58Bi 138 280   Test Results Test J-STD-004 or other requirements (as stated)  Test Requirement  Result  Copper Mirror IPC-TM-650: 2.3.32  L: No breakthrough  Corrosion  IPC-TM-650: 2.6.15  L: No Corrosion 

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$50 (-$35.01)