AMTECH NC-559-AS TF

DOWNLOADS Technical Data Sheet  Safety Data Sheet  PRODUCT INFO AMTECH NC-559-AS-TF is formulated for syringe, stencil printing, and rework applications on all PCB surface finishes. AMTECH NC-559-AS-TF may be used for BGA sphere attachment and reballing. AMTECH NC-559-AS-TF is also designed to work on all flip chip bumping and chip scale packaging sites. AMTECH NC-559-AS-TF is a no-clean tacky flux that can be left on the board for many SMT assemblies.  Product Highlights: ROL0 flux classification  Wide process window Excellent wetting compatibility on most board finishes Clear residue High temperature compatible Available Alloys Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 60Sn/40Pb 183-191 361-376 43Sn/43Pb/14Bi 144-163 291-325 42Sn/58Bi 138 280   Test Results Test J-STD-004 or other requirements (as stated)  Test Requirement  Result  Copper Mirror I