AMTECH LF4300.2 TF

DOWNLOADS Technical Data Sheet    Safety Data Sheet  PRODUCT INFO Product Highlights REL1 flux classification  Optimized for lead-free and standard alloy systems Wide process window  Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)  Excellent wetting compatibility on most boar finishes  Low voiding, including LGA  REACH compliant  Application  AMTECH 4300/LF-4300.2-TF is formulated for syringe, stencil, printing, and rework applications on all PCB surface finishes. AMTECH 4300/LF-4300.2-TF may be used for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.  Compatible Alloys   Alloy Temp °C Temp °F 63Sn/37Pb 183 361 62Sn/36Pb/2Ag 179 354 62.8Sn/36.8Pb/0.4Ag 179-183 354-361 42Sn/58Bi 138 280 42Sn/57Bi/1Ag 138 280 96.5Sn/3.0Ag/0.5Cu 217-220 423-428 99.0Sn/0.3Ag/0.7Cu 217-221 423-430 96.5Sn/3.5Ag 221 430 99.3Sn/0.7Cu 227 441 95Sn/%sB 235-240 455