WL BGA Reballing Stencils For iPhone Baseband NAND A6-A14 CPU BGA
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WL BGA Reballing Stencils For iPhone Baseband NAND A6-A14 CPU BGA

$6.99
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WL 0.1mm BGA reballing stencils kit for iPhone Baseband NAND A8-A16 upper lower CPU soldering repair, BGA reballing stencil template come with black positioning mold, WL high quality soldering BGA reballing stencil with fixed plate, WL high accuracy solder Jig template ball solder stainless steel net for iPhone Baseband NAND chip, A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU BGA reballing stencils template. WL 0.1mm BGA Reballing Stencils Kit with Black Positioning Mold For iPhone A8 A9 A10 A11 A12 A13 A14 A15 A16 CPU Baseband NAND Soldering Repair Tool[ Optional Types ] : Option 1: A8 CPU Upper Option 2: A8 CPU Lower Option 3: A9 CPU Upper Option 4: A9 CPU Lower Option 5: A10 CPU Upper Option 6: A10 CPU Lower Option 7: A11 Upper layer+lower layer Option 8: A12 Upper layer+lower layer Option 9: A13 Upper +lower  Option 10: A14 Hard disk+baseband Option 11: A14 CPU Positioning version  There are 3 sections of parts, BGA Reballing Stencil + Mold Positioning (Black) + Aluminum Universal Mold

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