WL 0.1mm BGA Reballing Stencils Kit For iPhone A8-A16 CPU

WL 0.1mm BGA Reballing Stencil for iPhone Baseband NAND A8-A16 CPU soldering repair, 0.1mm BGA reballing stencil solder template for iPhone A16 A15 A14 A13 A12 A11 A10 A9 A8 CPU Baseband NAND, iPhone A8-A16 CPU repair template, Stainless steel reballing soldering net for iPhone X-14promax baseband and NAND chip.WL 0.1mm BGA Reballing Stencil Template For iPhone Baseband / NAND / A8-A16 CPU Upper / Lower[ Option BGA Reballing Stencil Package ] :Suggest Choose: BGA Reballing Stencil + Black Positioning Mold(Choose different package ), and just 1pcs Aluminum Mold Base, easy for your working, and also save money Option 1: iPhone 5/5S Baseband and NAND Option 2: iPhone 6/6P Baseband and NAND Option 3: iPhone 6S/6SP Baseband and NAND Option 4: iPhone 7/7P Baseband and NAND Option 5: iPhone 8/8P/X Baseband and NAND Option 6: iPhone XS MAX XR Baseband and NAND Option 7: A6 CPU upper -- out of stock Option 8: A7 CPU Upper Option 9: A6 / A7 CPU Lower Option 10: A8 CPU Upper Option 11: A8 CPU