WL 2 In 1 CPU NAND BGA Reballing Stencil Platform for iPhone 6-XSM
www.diyfixtool.com
Electronics / Circuit Boards & Components

WL 2 In 1 CPU NAND BGA Reballing Stencil Platform for iPhone 6-XSM

$6.95
{{option.name}}: {{selected_options[option.position]}}
{{value_obj.value}}
Store Logo

CHINA PHONEFIX SHOP Team

View Store

WL 2-IN-1 CPU NAND Baseband IC BGA Reballing Stencil Platform Positioning Mold for iPhone 6 6S 7 8 X XR XS XS Max Description : When you purchase this product for the first time, you must first purchase the magnetic base Magnetic base + Positioning plate + Tin mesh (Together to use) Features : 0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing solder working It is the top quality BGA Reballing Stencil for iPhone CPU and NAND, A9 / A8 / A10 / A11 / A12 WL Top quality fast speed BGA Reballing Solder Template Stencil Optional Positioning Plate (Black) : Not universal, can't working with different BGA Reballing StencilNeed the right model BGA Reballing Stencil, the Black Positioning Plate just match with the right BGA Reballing Stencil Package included : 1pc x BGA Reballing Stencil

Show More Show Less