MECHANIC MagTin Magnetic Levitation Chip Tin Planting Platform
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Business & Industrial / Manufacturing

MECHANIC MagTin Magnetic Levitation Chip Tin Planting Platform

$15.59
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MECHANIC MAG Tin magnetic levitation chip tin planting platform CPU hard disk position steel mesh for iPhone series/ Huawei series/ Qualcomm series. Mechanical magnetic levitation chip tin planting platform with template is suitable for iPhone Huawei Qualcomm IC CPU Nand flash memory font re-ball soldering. Option: 1. Standard set: MagTin positioning platform + iPhone A8-A15 CPU stencil(8pcs). 2. Qualcomm series stencil only(7pcs). 3. Huawei series stencil only(8pcs). Features: 1. Strong Magnetic: According to the principle of magnetic levitation. 2. Automatically adsorbed and clamped the steel stencils. 3. Infinite Update: For all BGA chip tin planting, constantly updated. 4. Steel Stencils Set: iPhone series, Huawei series, Qualcomm series. 5. Premium Imported: High temperature resistance of 500°C no deformation or bulging 6. Made of AAAA grade steel, good flexibility. 7. Magnetic Module: Fix the chip in the upper left corner of the chip groove. 8. Make the magnetic module withstan

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