Low Temperature 138℃ Sn42-Bi58 Lead Free Solder Paste 42g

PHONEFIX 138℃ Low Temperature Lead Free Solder Paste For Apple Samsung Mobile Phone Motherboard BGA Repair: NAND Flash CPU Wifi BGA Soldering Repair, 42g 138℃ Sn42/Bi58 Lead Free Solder Paste for iphone samsung cell phone PCB circuit board repair like BGA welding or BGA Stenciling.Note:  Solder paste flux, liquid and rosin can only be sent by special post mail.Option Type:Option 1: FIX-230 Sn42/Bi58 - Needle tube - 42gOption 2: FIX-231 Sn42/Bi58 - Canned - 55gFeatures:The melting point of low temperature is about 138℃, Solder joints turn off, Good temperature and moisture, Full solder jointLead free is environmentally friendly. It contains no lead but silver, good conductivity and higher price (lead is harmful to human body, when welding the motherboard, people will breathe in lead, which is toxic substances, not conducive to the health of the repairmen)Strong continuous printing performance, suitable for fine pitch IC and BGA and precision components welding.Good wettability, good res