IBGA13 Max Mid-Level Motherboard Reballing Platform For iPhone 13 Pro Max
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Electronics / Computers

IBGA13 Max Mid-Level Motherboard Reballing Platform For iPhone 13 Pro Max

$17.99
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MECHANIC IBGA 13 MAX 14 in 1 Middle Frame Reballing Platform Motherboard Fixture with Stencil For iPhone X/XS/XS Max/11/11 Pro/11 Pro max/ 12/12 mini/12 Pro/12 Pro max/13/13 mini/13 Pro/13 Pro Max. MECHANIC iBGA13 MAX Middle Layer Positioning Tin Planting Platform Stencil Suit Support for iPhone X-13 Pro Max Mini Series.Features:1. Double-sided positioning - single module realizes the middle-layer tin planting of X-13 system.2. Strong magnetic adsorption - no displacement during the tin planting process.3. Special grade steel mesh-mesh precision tin planting Wulian tin.4. High temperature base - high temperature operation does not change shape, quality assurance!Usage Steps:Take out the Mechanic IBGA 13 max tin planter and place the bottom platePlace gaskets as needed (when planting tin in the RF middle frame of the XS Max motherboard, you need to place functional functional gaskets and then place the RF dedicated tin planting net)Place the main board and locate it through the position

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