AMAOE Mbga-B14 Android Phone CPU Tin Planting Glue Remova Kits
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AMAOE Mbga-B14 Android Phone CPU Tin Planting Glue Remova Kits

$35.99
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AMAOE Reballing Stencil Station Kits for Reballing Stencil Station Kits for Reballing Stencil Station Kits. AMAOE Mbga-B13/IP13 4 in 1 middle layer tin planting station is suitable for iPhone13/13Pro/ Pro Max/mini Tin Mesh. Amaoe Mbga-B14 BGA Reballing Stencil For Samsung Exynos CPU Reballing Stencil CPU Stencil. Features: 1. AMAOE Mbga-B1 10 IN 1 Middle layer reballing stencil kits for iphone X XS XSMAX 11 12 11Pro/Max 12MINI. 2. AMAOE Mbga-B2 for iphone A8 A9 A10 A11 A12 A13 CPU Positioning Plate Steel Mesh Planting Tin Delete Glue Platform Fixed Fixture. 3. AMAOE Mbga-B3 tin planting station/mobile phone font/hard disk/memory/7 in 1/positioning board/steel mesh. 4. Amaoe Mbga-B4 positioning platform for iphone 11/12 pro CPU A13 A14 NAND BASEBAND CPU WIFI IC chip BGA Reballing stencils. 5. AMAOE MBGA-B5 planting tin platform/Android phone CPU/ planting tin/glue removal/positioning board /CPU steel mesh. 6. AMAOE MBGA-B6 planting tin platform/Android phone CPU/ planting tin/glue remo

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