183℃ Sn62.8-Pb36.8-Ag0.4 Solder paste Phone BGA Soldering Tin Cream
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183℃ Sn62.8-Pb36.8-Ag0.4 Solder paste Phone BGA Soldering Tin Cream

$1.99
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Medium temperature 183℃ Sn62.8/Pb36.8/Ag0.4 lead solder paste 55g, phone motherboard BGA chip soldering tin cream, melting point 183℃ Medium temperature phone PCB BGA solder flux paste, High quality medium temperature tin paste melting point is about 183℃. Medium temperature solder paste with lead, melting point is 183℃, Sn62.8/Pb36.8/Ag0.4, 55g or 42g.Two types of packaging:1: Syringe packaging: Needle tube FIX-229 Sn62.8/Pb8/Ag0.4 42g2: Canned packaging:FIX-228 Sn62.8/Pb36.8/Ag0.4 55gGood conductivityShining solder jointsGood moisturizingFull solder jointGood tin drop performanceFeatures:1. With strong continuous printing performance, it is suitable for fine pitch IC, BGA and relatively nice component soldering.2. Wettability and demould properties are good, anti-cold & hot collapse and anti-dry are strong.3. Applicable to a variety of high-demand materials PCB welding, nice pitch and high-precision components and few tin-connection tombstoning displacement phenomenon.4. Full tin

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