RMA-063 T3-T6 - Sn63Pb37 classic RMA no-clean MT rosin mildly activated eutectic solder paste (ROL0)

RMA Sn63Pb37 T3 no-clean MT rosin mildly activated eutectic ROL0 solder paste RMA Sn63Pb37 soldering paste for SMT assemblies conforming to space exploration and defense contractors specs. Small syringe container for repair/rework, prototyping. Liquidus/solidus point - 183C (Eutectic). Powder composition: 63% Tin, 37% Lead. Made with classic RMA-TF no-clean soldering tacky paste flux High-quality leaded Sn/Pb solder powder made using virgin raw materials. Consistently shaped microscopic granules evenly suspended in a golden body of a rich in solids thick RMA soldering tacky flux. Activates immediately, demonstrating professional industrial wetting on most PCB finishes, smooth dispensing, quick and efficient soldering/desoldering and effortless cleaning with IPA or Hot Air RMA solder paste can be applied as a BGA alternative or as a liquid solder for PCB repair and rework - delivers instant bridge-free reflow with Hot Air. Quick response to a solder iron. Essential for leaded rework/re