ASM-424 T3-T6 - Sn42Bi57.6Ag0.4 low-temperature no-clean solder paste 0.4% silver (ROL0)
$10.92
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Low-temp solder paste for electronics assembly using ASM solder flux. Used for attachment of temperature-sensitive components to printed circuit boards, step soldering, warpage prevention, flexible circuits and large area array devices. Delivers reliable solder connections with low-temperature reflow. Solders low-Tg flexible boards and circuits used in phones, wearables and IoT devices Low-temp BGA paste reduces HIP (head-in-pillow) and NWO (non-wet-open) defects to minimum.
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