G03200 - SEMI G32 - Guideline for Unencapsulated Thermal Test Chip

This Standard was technically approved by the global Assembly & Packaging Technical Committee. This edition was approved for publication by the global Audits and Reviews Subcommittee on July 1, 2011. Available at www.semiviews.org and www.semi.org in August 2011; originally published in 1994.   NOTICE: This Document was reapproved with minor editorial changes.   This Guideline details recommendations for a standardized thermal test chip design for referee test purposes. A sample data format for the test chip can be found in Appendix 1. Based on the results of computer simulations of various chip-substrate configurations, the following recommendations are made for the design of thermal test chips for VLSI package characterization.  　Referenced SEMI StandardsNone.