G02700 - SEMI G27 - Specification for Leadframes for Plastic Leaded Chip Carrier (PLCC) Packages

This specification is a guideline for high volume production of leadframes for plastic leaded chip carrier semiconductor packages. It is a design guideline for packaging engineers, leadframe stampers, and mold manufacturers, and has been developed to meet the requirements of automatic assemblers.　Referenced SEMI Standards SEMI G4 — Specification for Integrated Circuit Leadframe Material SEMI G10 — Standard Method of Mechanical Measurement for Leadframes SEMI G18 — Specification, Integrated Circuit Leadframe Materials Used in the Production of Etched Leadframes SEMI G21 — Specification, Plating Integrated Circuit Leadframes