3D01900 - SEMI 3D19 - Test Method for Adhesive Strength of Adhesive Tray Used for Thin Chip Handling

 1  Purpose1.1  The purpose of this Standard is to establish the standard for the adhesive strength test method of adhesive tray used for thin chip handling and shipping.2  Scope2.1  This Standard covers measuring system (system configuration, die pick up tool).2.2  This Standard states test method (die mount layout, measurement environment, peeling speed etc.). Referenced SEMI Standards (purchase separately)SEMI G97 — Specification for Adhesive Tray Used for Thin Chip Handling Revision HistorySEMI 3D19-0619 (Reapproved 1224)SEMI 3D19-0619 (first published)