MC302 Benchtop Reflow Oven

Ideal for Labs, Small-Scale Production, Schools, Prototyping, and More. Measuring only 789 mm L x 742 mm W x 483 mm H (31" x 29" x 19") and weighing under 125 kg, the MC302 easily installs on virtually any benchtop. Its ability to simulate inline reflow profiles with preheat, soak, reflow, and cooling phases makes it a great choice for labs or other installations where space is often at a premium. The front-loading heating chamber has an effective soldering area of 320 mm x 220 mm and includes a window for viewing of the soldering process. Full Hot-Air Soldering Processing The new generation MC302 Benchtop Convection Reflow Oven is equipped with a full hot air convection system. Hot air is spread evenly to every corner of the PCB board, avoiding shadow effects and color sensitives to temperature sensing deviation and making the heating efficiency of components consistent. Built-In Dual Core CPU Based Control Application The MC302 CPU based control app provides an easy to