Auto-Dip 6035TS Dip Soldering System

Principle of Operation Pre-fluxed PCBs are placed onto the tips of the board holder pins which are positioned above the molten solder surface at the start of the cycle. When the foot pedal is depressed, the elevator motors begin to lower the PCB toward the solder pot. Independent, dial-adjustments control the speeds of the motors. The difference in the speed between the right and left motors establishes the angle at which the PCBs touch the solder surface. As both motors continue to move the frame downward, the molten solder surface sweeps across the bottom of the PCB. The larger the difference in speed, the steeper the angle; the smaller the difference, the more parallel the PCBs are to the solder surface at contact. This motion continues until the tips of all the pins are completely immersed in the molten solder. At this point, the assemblies are actually floating on the surface due to the high density of the molten solder. The length of time that the PCBs rest on the solder su