AMTECH NC-559-V3 TF

DOWNLOADS Technical Data Sheet    Safety Data Sheet PRODUCT INFO AMTECH NC-559-V3 is the 3rd generation of the famous NC-559 tacky flux. Developed to achieve even better wetting and a clearer transparent residue, it is formulated for syringe application, stencil printing and rework processes on all PCB surface finishes. AMTECH NC-559-V3 performs excellent for BGA sphere attachment and reballing. It is also designed to work on all flip chip bumping and chip scale packaging sites.  ROL0 flux classification  Wide process window Excellent wetting compatibility on most board finishes  Clear residue  High temperature compatible  Compatible Alloys  Alloy  Temp °C  Temp °F  63Sn/37Pb  183  361  62Sn/36Pb/2Ag  179  354  62.8Sn/36.8Pb/0.4Ag  179-183  354-361  60Sn/40Pb  183-191  361-376  43Sn/43Pb/14Bi  144-163  291-325  42Sn/58Bi  138  280  10Sn/88Pb/2Ag  268-290  514-554  Test Results Test J-STD-004 or other requirement