AMTECH 4300 Sn63/Pb37 T3 87%

DOWNLOADS Technical Data Sheet  Safety Data Sheet  PRODUCT INFO Product Highlights REL0 flux classification in a Water Washable Solder Paste Tier I Military/Avionic OEM approved  Exceptional print definition at high printing speeds up to 100mm/sec  Residue can be left on the board in most assemblies (not recommended for high impedance assemblies)  Clear residue  Low voiding, including LGA components  Low mid-chip beading  REACH compliant  Compatible with enclosed print heads  Print and dispense grade solder paste available  Available Alloys  Alloy Temp °C Temp °F 63Sn/37Pb 183 361 Test Results  Test J-STD-004 or other requirements (as stated)  Test Requirement  Result  Copper Mirror  IPC-TM-650: 2.3.32  L: No breakthrough  Corrosion  IPC-TM-650: 2.6.15  L: No corrosion  Quantitative Halides  IPC-TM-650: 2.3.28.1  L: <.05%  Electrochemical Migration  IPC-TM-650: 2.6.14.1  L: <1 decade drop (no-clean)  Surface Insulation Resist