
CHIPSEN BoT-TMA50DU Bluetooth v5.3 BLE Class1 (+20dBm) DIP Slave/Master/Multicon 1:8 Module w/ U.FL Antenna
Please CONTACT US for OEM and Quantity Discounts. The CHIPSEN BoT-TMA50DU module features a BoT-TMA50 SMD Master/Slave/Multicon Long-Distance Bluetooth BLE module mounted on a DIP carrier with 2.54mm header pins and a U.FL antenna connector (antenna is not included). This module can be installed in through-hole PCBs, mounted in 2.54mm sockets for easy removal, or can be plugged into the CHIPSEN BoT-USB-TB Test Board to easily connect the module to a PC's USB port. The electrical and performance specifications for this module are the same as the BoT-TMA50. See the BoT-TMA50 OEM Long-Distance Bluetooth module product page for full specifications. BoT-TMA50DU Features Bluetooth Processor: BoT-TMA50 (Master, Slave or Multicon Mode) BT Version: Bluetooth Low Energy (BLE) V5 .3 Built in Chip Antenna + U.FL Antenna Connector Bluetooth Smart (Bluetooth Low Energy) Module ARM® Cortex® M4 32 bit processor with FPU, 64 MHz Memory: 512 kB Flash / 128 kB RAM RF Output Power: up to 20 dBm E.I.