Mechanic Paste Flux with Syringe for Mobile Phone

Particle Size: 25-48μmItem Name: BGA Soldering Tin CreamDesign: Needle TubeColor: Colorless TransparentType 2: BGA Soldering PasteModel 2: Dispenser Needle SolderMicrons: 25-45umApplication: for Phone PCB BGA Soldering ToolsUsage: PCB BGA Repairing ToolFunction: for Phone Circuit Board SMT WeldingFeatures 1: Squeeze Tube /Plunger DispenserFeatures 2: Sticky, Durable, Easy to ReplaceFeatures 3: No False Welding PhenomenonInsulated: YesSuitable for: Phone, Computer Repair IndustryMaterial: Soldering Paste Cream100%: High QualityParticle Size: 10mlCondition: New, UnusedPacking: Bag