MECHANIC iBGA 13 Reballing Stencil Platform For iPhone 13 Pro Max Mini
$13.99
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MECHANIC iBGA 13 Middle Layer Motherboard Reballing Kit For iPhone 13 mini pro max Template Soldering Platform With Stencil, 4 in 1 BGA Reballing Stencil Platform Motherboard Middle Rework Tin Mesh Template for iPhone 13/13 Pro/13 Pro Max/ 12 mini.Features:1. Anti-leakage tin barrier design.2. High temperature does not allow the drum.3. Strong magnetic automatic positioning, precision positioning.4. Integrated, removable tin planting.5. Positioning slot of the double-sided motherboard.6. For iPhone 13/13mini/13 Pro/13 Pro Max.
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