JTX JP-1 Universal Preheater for Phone PCB Layering Glue Removal

JTX JP-1 300W Universal Preheating Platform for mobile phone/iPhone motherboard layering, lamination, reballing tinning, and glue removal repair. JTX JP-1 heating station is suitable for mobile phone PCB repair, circuit board CPU chip reballing, BGA chip and FPC connector socket and other precision parts disassembly and assembly.Features:1. Universal heating platform is suitable for mobile phone motherboard layering, lamination, tinning, and glue removal repair.2. Improve efficiency, precise heating, suitable for mobile phone motherboards of various sizes3. Heating plate is made of aviation aluminum, which can conduct heat quickly and is durable, which helps the device to have uniform heat distribution and a longer service life.4. LED digital display thermostat with precise temperature control, which can be easily operated by preset temperature.5. Maximum power 300Wg, wide voltage frequency conversion adaptation, supporting both 110V and 220V, and faster heating.6. Enhanced heating are