Amaoe BGA Reballing Stencil For Huawei CPU HU:1-4
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Amaoe BGA Reballing Stencil For Huawei CPU HU:1-4

$2.55
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AMAOE BGA reballing stencil 0.12mm HU:1 HU:2 HU:3 HU:4 for Huawei HI CPU series soldering repair. Amaoe BGA reballing stencil Huawei CPU tin planting steel mesh for Huawei CPU chip tin planting soldering repair.Option:HU:1: For Huawei HI3650 HI3660 HI3630.HU:2: For Huawei HI6250 HI3660 HI6220.HU:3: For Huawei HI6260 V100, HI3670, HI3680, HI6260 V101, HI3670/80.HU:4: For Huawei HI6290/L V1, HI3690 5G, HI3690 CPU, HI6280, HI9500 V1, HI3690 RAM. Features:1. Brand New. 2. BGA stencil for reballing pins For Huaiwei CPU RAM IC Advantage:1. Deformation resistant material.2. Precise pins locatioN.3. Square round hole.4. Good material.

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