RF4 H2 1000W Fast Desoldering Hot Air Gun

I. Functional uses 1.   The equipment is mainly used for dismantling and welding the surface mount of electronic components Such as: SOIC, CHIP, QFP, PLCC, BGA, etc. 2.   Used for disassembly and welding of mobile phone wiring and wiring holder. 3.   It can be used for heating, drying, removing paint, removing glue, thawing, bonding, thermal testing and other processes that need heating for heat shrinkable hose and various plastics. II . Packing List Attachment: After receiving this product, please open the package and check whether the following basic accessories are missing. There are many types of welding table, different types of accessories will increase or decrease, please consult with local vendors. Ⅲ . Product performance description 1.   This equipment adopts resistance wire heating, K-type thermocouple sensing closed loop microcomputer PID full program temperature control. It has advanced prediction, accurate temperature control,